VLSI Services

Design Services include:

• Physical implementation: place & route, timing analysis, extraction, verification and DRC
• DFT / DFM: testability analysis, test development and manufacturing process analysis
• Package design: custom package design, thermal analysis and chip / package interface simulation

Productization services include:

• Device qualification: custom qualification programs, stress and life testing
• Fast / slow device characterization
• Yield ramp: test data analysis and process tuning

Manufacturing services include:

• Long-standing relationship with TSMC, enabling unparalleled manufacturing services
• Multiple suppliers to address standard and custom package needs
• with both domestic and offshore testing facilities for complete support of your chip requirements.